From Plasma to AI Hardware: Wafer-Scale 2D Logic and Memory for In-Memory Computing

Low-temperature wafer-scale synthesis of two-dimensional materials enables scalable electronic platforms for next-generation AI hardware. This talk presents high-crystalline 2D films for logic devices and nanocrystalline 2D films for low-variability memristor memory. Future directions include monolithic 3D integration of 2D logic and memory toward 1T1R arrays for vector–matrix multiplication.

Taesung Kim is Dean of the College of Engineering and Professor of Mechanical Engineering, Semiconductor Convergence Engineering, and SKKU Advanced Institute of Nanotechnology (SAINT) at Sungkyunkwan University (SKKU). His research covers wafer-scale synthesis of 2D materials and their applications, CMP and cleaning processes, tip-enhanced nanoscale science, and emerging nanoelectronic devices.