R.J. Ram
Novel optical and electronic devices for applications ranging from communication networks, efficient energy production, to biosensing and bioprocess development.
36-491 617-
253-4182
rajeev@mit...
Rafael Reif
Integrated circuit fabrication technology. New process technologies for
VLSI. Environmentally conscious manufacturing. Novel interconnect technologies.
38-401
253-7317
reif@mtl.mit...
Caroline Ross
Magnetic films and structures for data storage, nanostructures based on
self-assembly processes.
13-4005
258-0223
caross@mit...
Rahul Sarpeshkar
Bioelectronics: Ultra Low Power analog VLSI for bionic systems, mixed-signal
computing systems, and sensory systems.
38-294
258-6599
rahuls@mit...
Mark L. Schattenburg
Advanced lithography, including X-ray, electron-beam, ion-beam, and optical.
Nanotechnology and nanofabrication. Precision engineering and nano-accuracy
dimensional metrology. Advanced interference lithography technology for
super-accurate patterning of general grating and grid patterns. Micro and
nanometer fabrication technology applied to advanced astronomical and laboratory
instrumentation. Silicon micromachined structures applied to high-precision
optical assembly. X-ray optics and instrumentation.
37-487
258-0223
marks@space.mit...
Martin A. Schmidt
MicroElectroMechanical Systems (MEMS). Microfabrication technologies for
integrated circuits, sensors, and actuators. Design of microsensor
and microactuator systems.
39-521
253-7817
schmidt@mtl.mit...
Alexander H. Slocum
MEMS, Nanotechnology, Precision Engineering, Machine Design, Product Design
3-445
253-0012
slocum@mit...
Henry I. Smith
Nanofabrication, nanostructures and metrology. Integrated-optical, photonic-bandgap,
high-density-magnetic, and short-channel devices. E-beam, X-ray, deep UV, and
interferometric lithography. Diffractive optics for photons and neutral atoms.
39-427B
253-6865
hismith@nano.mit.edu
Charles G. Sodini
Design of technology intensive microsystems emphasizing integrated circuit design
at the device level. Specific systems of interest include low power wireless
cameras and displays, high data rate wireless LANs and low data rate wireless
sensor systems.
39-527
253-4938
sodini@mtl.mit...
Mark Spearing
Materials and Process Selection for MEMS; Structural design of MEMS. Mechanical
testing of microfabricated materials. Microfabricated refractory
material process development. Residual stress determination and reduction.
Wafer bonding. Membrane structures. MEMS Packaging. Power-producing MEMS.
33-318
253-4467
spearing@mit...
Vladimir Stojanovic
Modeling of noise and dynamics in circuits and systems. Application of
convex optimization to digital communications, analog and VLSI circuits.
Communications and signal processing architectures. High-speed electrical
and optical links, on-chip networks and signaling, clock generation
and distribution. High-speed digital and mixed-signal IC design.
38-260
4-4913
vlada@mit...
