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Chuei- Tang Wang received the B.S. and M.S. degrees in materials science and engineering from National Tsing Hua University, Hsinchu, Taiwan, in 1983 and 1985, respectively, and the Ph.D. degree from Stanford University, Stanford, CA, USA, in 1997. In 2011, he joined TSMC Integrated Interconnect and Packaging (IIP) R&D team as a Technical Director for system architectures and their SI, PI and RF performance exploratory study. He had received a National Award of Industrial Technology Advancement (ITA), Taiwan, for the leadership of connectivity SiP module development in industry in 2007. He holds more than 100 US patents and publishes 20 papers in IEDM, VLSI, ECTC and etc. Now he is a committee member in RF, High-Speed Components & Systems subcommittee in ECTC.