Keywords April 29, 2026 MTL Seminar Series Advanced CMOS+X Memory Platform for Novel Memory Integrations Karsten Beckmann, NY Creates & University at Albany April 22, 2026 MTL Seminar Series Challenges and Opportunities for Insect-Scale Autonomous Aerial Robots Kevin Chen, MIT April 6, 2026 MTL Seminar Series From Plasma to AI Hardware: Wafer-Scale 2D Logic and Memory for In-Memory Computing Taesung Kim, SKKU March 11, 2026 MTL Seminar Series Acoustic Wave Microsystems for Chip-scale RF and Optical Signal Processing Siddhartha (Sid) Ghosh, Northeastern University February 18, 2026 MTL Seminar Series Energy-Efficient Computing and Communication: Perspectives on Chiplet Interconnects and Photonic Networks Victor Li, TSMC December 18, 2025 MTL Seminar Series High-Speed Integrated Circuits for Scalable Quantum Computing Jinchen Wang, DDS December 3, 2025 MTL Seminar Series Polymer-based Deformable and Morphing Electronics Alex Chortos, Purdue October 29, 2025 MTL Seminar Series MIDDAS: Memory Integration and Data Dis-Aggregation (Joint with AI HW Program) Shuhan Liu, Stanford October 22, 2025 MTL Seminar Series Innovations in Patterning of Semiconductor Devices Rich Wise, Lam Research October 8, 2025 MTL Seminar Series Printing Where It Matters: Embedding Two-Photon Microfabrication into Applied and Research Workflows Milan Matějka, Institute of Scientific Instruments of the Czech Academy of Sciences Load More
April 29, 2026 MTL Seminar Series Advanced CMOS+X Memory Platform for Novel Memory Integrations Karsten Beckmann, NY Creates & University at Albany
April 22, 2026 MTL Seminar Series Challenges and Opportunities for Insect-Scale Autonomous Aerial Robots Kevin Chen, MIT
April 6, 2026 MTL Seminar Series From Plasma to AI Hardware: Wafer-Scale 2D Logic and Memory for In-Memory Computing Taesung Kim, SKKU
March 11, 2026 MTL Seminar Series Acoustic Wave Microsystems for Chip-scale RF and Optical Signal Processing Siddhartha (Sid) Ghosh, Northeastern University
February 18, 2026 MTL Seminar Series Energy-Efficient Computing and Communication: Perspectives on Chiplet Interconnects and Photonic Networks Victor Li, TSMC
December 18, 2025 MTL Seminar Series High-Speed Integrated Circuits for Scalable Quantum Computing Jinchen Wang, DDS
December 3, 2025 MTL Seminar Series Polymer-based Deformable and Morphing Electronics Alex Chortos, Purdue
October 29, 2025 MTL Seminar Series MIDDAS: Memory Integration and Data Dis-Aggregation (Joint with AI HW Program) Shuhan Liu, Stanford
October 22, 2025 MTL Seminar Series Innovations in Patterning of Semiconductor Devices Rich Wise, Lam Research
October 8, 2025 MTL Seminar Series Printing Where It Matters: Embedding Two-Photon Microfabrication into Applied and Research Workflows Milan Matějka, Institute of Scientific Instruments of the Czech Academy of Sciences
