Jesús del Alamo honored with 2019 University Research Award for excellence in semiconductor technology research

del Alamo recognized by the Semiconductor Industry Association and the Semiconductor Research Corporation

Photo: Jesus del Alamo receiving the University Researcher Award from John Neuffer, president and CEO of Semiconductor Industry Association (left) and Keith Jackson, Chair of the SIA Board of Directors and president and CEO of ON Semiconductor (right) at the SIA Awards Dinner in San Jose, CA, on November 7, 2019.

The Semiconductor Industry Association ISIA) in collaboration with the Semiconductor Research Corporation (SRC) selected Prof. Jesús del Alamo as recipient of the 2019 University Research Award for excellence in semiconductor technology research. del Alamo is Donner professor and professor of electrical engineering at the Department of Electrical Engineering and Computer Science at MIT. He is also Director of MIT’s Microsystems Technology Laboratories.

In a press release announcing the award, the president and CEO of SIA, John Neuffer, states that “Research is essential to semiconductor innovation, spurring advances that underpin all the important transformative technologies of today and tomorrow.” Ken Hansen, president and CEO of SRC is quoted as saying that “We are proud to honor these outstanding SRC-sponsored researchers for their tremendous achievements in their fields. Their accomplishments serve as a model for researchers everywhere and are an inspiration to the 1,300 active SRC-sponsored graduate students that form the semiconductor workforce and leadership of the future.” Together with del Alamo, Prof.  Jason Cong from UCLA was awarded a University Research Award for excellence in semiconductor design research.

According to the SIA press release, Jesús del Alamo “is being recognized for significant contributions over more than 30 years to education and the advancement of semiconductor devices in physics, technology, modeling, and reliability. His contributions have been adopted and deployed in many commercial semiconductor fabs, providing the foundation for increased performance and integration and opening doors to many new applications.”