Advance could enable artificial intelligence on household appliances while enhancing data security and energy efficiency.
The stunning emergence of a new type of superconductivity with the mere twist of a carbon sheet has left physicists giddy, and its discoverer nearly overwhelmed.
Design is the first demonstration of a magnetic, multi-material pump 3D printed all in one piece.
Tomás Palacios' group receives prestigious award.
MIT engineers develop a hybrid process that connects photonics with “artificial atoms,” to produce the largest quantum chip of its type.
Juejun Hu pushes the frontiers of optoelectronics for biological imaging, communications, and consumer electronics.
2021 IEEE Technical Field Award Recipients and Citations