March 9, 2022
MTL Seminar Series

EUV Lithography: What’s Happening and What’s Next​

Tony Yen, ASML
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Anthony Yen is Vice President and Head of Technology Development Center at ASML, responsible for providing the company with mid- and long-term technology directions and working with customers, peers, universities, and research centers to develop enabling technologies. Prior to joining ASML, he headed Nanopatterning Technology Infrastructure Division at TSMC and played a key role in bringing EUV lithography, including its mask technology, to high-volume production. He received BSEE from Purdue University and SM, EE, PhD, and MBA from MIT. He is a Fellow of the IEEE and SPIE, and was awarded Outstanding Electrical and Computer Engineer by Purdue.

Nanolithography enables our intelligent society and extreme-ultraviolet (EUV) lithography is the latest enabling lithographic technology. ASML’s EUV exposure tools are being used in the high-volume production of logic and memory chips. In the words of Professor Jesús del Alamo of MIT, “It’s an absolutely revolutionary product, a breakthrough that is going to give a new lease of life to the industry for years.” For this presentation, I will start with a brief history of the development of EUV lithography and then present the technology’s present status, including its use in the manufacture of logic integrated circuits. I will then give a progress report on our next-generation EUV technology and an outlook for the rest of this decade.

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